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Acclerating the Transition to Advanced AI & Data Computing
01
Advanced Memory Integration
Soar Tech is expanding its assembly and validation capabilities for next-generation DDR5 and HBM memory modules. These high-performance components are essential for the rapid growth of AI, data-center, and high-performance computing workloads. Our goal is to bridge today’s component supply with tomorrow’s compute infrastructure.
02
AI-Optimized Supply Chain
We are building intelligent supply-chain systems that leverage analytics, automation, and real-time tracking to improve sourcing precision and yield. This technology-driven approach allows us to anticipate demand across volatile semiconductor markets and deliver consistent quality and availability to our partners.
03
Advanced Materials for Defense Applications
Through advanced IC recovery and re-ball processes, Soar Tech extends the usable life of critical components, minimizing e-waste while securing additional capacity for emerging markets. Our recovery model supports both environmental responsibility and long-term supply stability for the compute ecosystem
What We do
01
Product Assembly
Precision assembly of DRAM and storage modules, complete with custom engraving and packaging for OEM or channel distribution.
02
Quality & Testing
Comprehensive inspection and performance testing of DRAM, SSD, and IC modules ensuring reliability, traceability, and compliance with global standards.
03
IC Recovery & Re-Ball
Advanced recovery and re-balling of integrated circuits to extend component life and optimize yield across HK, China, and Korea facilities.
04
Component Trading
Reliable global sourcing of DRAM, SSDs, and processors, backed by verified provenance, stable supply, and competitive lead times.
Powering the Next Generation of AI Memory
AI is transforming how the world uses and manages data, driving an unprecedented shift in memory technology. Traditional DRAM can no longer meet the bandwidth, efficiency, and scalability demands of AI, cloud, and edge computing.
Next-generation solutions such as DDR5, HBM3, and CXL are rising to meet these challenges. DDR5 delivers faster speeds and improved power efficiency for enterprise and data centers, HBM3 provides the ultra-high bandwidth required by AI GPUs, and CXL enables flexible, pooled memory architectures that scale with growing AI workloads.
Together, these technologies are redefining performance standards and fueling innovation across assembly, testing, and lifecycle management in the AI era.
Industry Transition
DDR5:
Delivers higher bandwidth and energy efficiency, accelerating adoption across enterprise servers and data centers.
HBM3:
Ultra-fast modules powering AI GPUs amid tight supply
CXL:
Enables pooled and scalable memory for AI infrastructure
Contact Us
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Contact us today.